THERMAL PAD 100X20X1.0
| Thermal pad (thermoconductive sponge) for processors |
| blue 100x20x1.0mm |
| Technical specifications: |
| Density: 3.3 g/cm |
| Hardness: 60.0+-5 Shore 00 |
| Thickness: 1.0mm |
| Electrical Insulation: >9 Kv/mm |
| Working Temperature: -50C~+200C |
| Thermal Coefficient: 6 W/m.K |
| Packaging: bulk 1 pc. |
